FluxPlus dispensing and printing paste flux is specially formulated for soldering applications that do not require the inclusion of solder powder with the flux. Each of the Flux Types is available in standard and specialty formulations to match different processing needs such as our super tacky BGA fluxes and our stainless steel-capable products.
Flux is the linchpin that holds the soldering process together. High quality solder joints are made possible through the surface cleaning action of flux. Regardless of your industry or your application, the goal is to apply the right amount of flux, no more and no less, to the right location every time. You want the flux to stay where it is placed and provide the solderability needed when heat is applied.
EFD's FluxPlus line of dispensable and printable tacky paste flux is designed to meet a variety of fluxing needs. Whether you are performing SMT rework, BGA ball attach, augmenting wire, preform or pre-bumped solder pads or just adding flux for a difficult-to-solder surface, there is a FluxPlus product in a Flux Type that meets your needs. You automatically deposit the required amount as fast as you need. This means less flux, faster deposits, neater results and proper fluxing.
Dispensable FluxPlus performs well with most standard dispensing equipment. There are no tip size restrictions for FluxPlus as there are for SolderPlus solder paste.
Printable FluxPlus can be used with standard stencil and screen printers. The most popular applications are BGA balling, BGA rework, and fluxing pre-bumped solder pads.